Structurally Integrated Electronics                   

Odyssian Technology has patent pending technology on 3D structural electronics.  Circuitry is structurally integrated into monolithic or sandwich structure.  This technology structurally integrates conventional hard substrate circuits, flex circuits, or printed polymer circuits into conventional or advanced structural elements.  Technology involves development of specific use circuitry and structure that allows for

The integration of electronics into structure allows for several advantages including:

·         Significant reduction in weight and size.

·         Improved resistant to thermal distortion.

·         Improved vibration tolerance.

·         Improved environmental protection and shielding.

·         Improved security, propriety, and tamper resistance.

Text Box: Patent # US 7,349,225 B1